Silver Sintering Die-attach at Zero Pressure For IGBT Power Module
The silver sintering process in the past utilized high amounts of pressure or force to complete the bond, but pressure-less silver sintering proved to be the better solution. This process relies on the unique formulation of the sintering material form a bond that is on par with the thermal and electrical conductivity of solder bonds, without needing to rely on flux or high temperature. There is much less concern about the voiding that comes with soldering processes than that which occurs when the solder liquefies.
Product Description：AS9375
Thick paste of nano-sized silver powder in an organic binder formulation.
Key Features：
Uniform dispersion for dispensing or screen/stencil printing
Low sintering temperature (<280℃)
Excellent sintered properties
RoHS compliant
Applications：
Bonding small to large chips (over 10mm x 10mm) for power devices/modules, high-power and high-brightness LED lamps, power diode lasers,IGBT，MOSFET， RF power devices.
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